发明名称 METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
摘要 <p>The present invention is to provide a composite copper foil composed of a very thin rolled copper foil and a carrier copper foil which carries an organic peeling layer and is coated onto both surfaces of the rolled copper foil, wherein the carrier copper foil includes a cutting line along a position spaced from an upper end outer edge with a predetermined width W and is peeled off along the cutting line from the rolled copper foil.</p>
申请公布号 KR101470371(B1) 申请公布日期 2014.12.08
申请号 KR20130070073 申请日期 2013.06.19
申请人 DAE DUCK ELECTRONICS CO., LTD. 发明人 BAE, YOO BIN
分类号 B32B15/01;H05K3/38 主分类号 B32B15/01
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