| 摘要 |
<p>The present invention relates to a method for manufacturing an integrated circuit package. A method for manufacturing an integrated circuit package according to the present invention includes a process (A) of mounting multiple semiconductor chips on a first surface of a substrate; a process (B) of forming a protection layer on the first surface of the substrate to entirely encapsulate the semiconductor chips; a process (C) of penetrating the substrate between the semiconductor chips, forming a separation groove to partly remove the protection layer, and then forming the separation groove with a depth which allows the separation groove to be divided into individual dies in a process for controlling the thickness of the semiconductor chips; a process (D) of attaching a protection film onto the second surface of the substrate; a process (E) of removing the back surface of the semiconductor chips and part of the protection layer and controlling the thickness of the semiconductor chips by removing it until at least the depth of the separation groove; and a process (F) of removing the protection film.</p> |
