发明名称 樹脂パターン及びその製造方法、MEMS構造体の製造方法、半導体素子の製造方法、並びに、メッキパターン製造方法
摘要 There is provided a method for producing a resin pattern, and the method includes at least the steps (1) to (7) in this order; (1) a coating step of coating a photosensitive resin composition on a substrate; (2) a solvent removal step of removing the solvent from the applied photosensitive resin composition; (3) an exposure step of patternwise exposing the photosensitive resin composition from which the solvent has been removed, to an active radiation; (4) a development step of developing the exposed photosensitive resin composition using an aqueous developer liquid; (5) an overcoating step of providing an overcoat layer on the developed photosensitive resin composition; (6) a heat-treating step of heat-treating the photosensitive resin composition on which the overcoat layer has been provided; and (7) a removal step of removing the overcoat layer.
申请公布号 JP5635449(B2) 申请公布日期 2014.12.03
申请号 JP20110102973 申请日期 2011.05.02
申请人 发明人
分类号 G03F7/40;G03F7/004;G03F7/022;G03F7/032;G03F7/039 主分类号 G03F7/40
代理机构 代理人
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