发明名称 Chemical mechanical polishing system
摘要 The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.
申请公布号 US8882563(B2) 申请公布日期 2014.11.11
申请号 US201113095404 申请日期 2011.04.27
申请人 Samsung Electronics Co., Ltd;K.C. Tech Co., Ltd. 发明人 Boo Jae Phil;Kim Dong Soo;Seo Keon Sik;Jeon Chan Woon;Ban Jun Ho;Goo Ja Cheul
分类号 B24B49/00;B24B5/00;B24B37/30;B24B37/34 主分类号 B24B49/00
代理机构 Kusner & Jaffe 代理人 Kusner & Jaffe
主权项 1. A chemical-mechanical polishing apparatus, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, wherein the path has a first path and a second path, said path including an unconnected path between the first path and the second path, wherein the substrate carrier unit is carried across the unconnected path by a carrier holder which accommodates the substrate carrier unit and moves across the unconnected path between the first path and the second path whereby the substrate carrier unit travels through the path.
地址 Suwon-Si, Gyeonggi-Do KR