发明名称 RESIN COMPOSITION, PREPREG, AND LAMINATE
摘要 To provide a prepreg resin composition which has good solubility in a solvent and with which moreover a cured product having excellent flame resistance and a low water absorption rate can be made simply and with good reproducibility, and a prepreg and a laminate and a printed wiring board and the like using the same. The prepreg resin composition of the present invention including at least a cyanate compound (A) obtained by cyanation of a phenol-modified xylene formaldehyde resin, an epoxy resin (B), and an inorganic filler.
申请公布号 US2014329066(A1) 申请公布日期 2014.11.06
申请号 US201214362200 申请日期 2012.11.30
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 Saito Chisato;Sogame Masanobu;Mabuchi Yoshinori;Kato Yoshihiro
分类号 H05K1/03;H05K1/05 主分类号 H05K1/03
代理机构 代理人
主权项 1. A prepreg resin composition comprising at least a cyanate compound (A) obtained by cyanation of a phenol-modified xylene formaldehyde resin, an epoxy resin (B), and an inorganic filler (C).
地址 Tokyo JP