| 摘要 |
<p>While a sealing sheet that has been cut to a size less than or equal to that of the shape of a semiconductor substrate is being held and transported by a pick-up plate (step S1A), convex portions on the rear face side of the sealing sheet, which is the adhesive surface of the sealing sheet, are inspected for by a displacement sensor (step S2A), and if convex portions are detected in the inspection, the sealing sheet is sandwiched and pressed by the pick-up plate and a pressing plate so to be flattened (step S3A). The flattened sealing sheet is tentatively pressure bonded on the semiconductor substrate while being pressed and heated by the pick-up plate (step S6).</p> |
