发明名称 レーザピアシング方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser piercing method by which a hole having the diameter of a degree to which drilling is smoothly shiftable to cutting is formed in a short time by irradiating a material to be cut with a laser beam. <P>SOLUTION: In the laser piercing method by which a through-hole 8 in the thickness direction is formed on the material to be cut by irradiating the material B to be cut with the laser beam 7 and also jetting assist gas composed of gaseous oxygen from a laser nozzle A to the material B to be cut, in the state where the focus S of the laser beam 7 is set in a position in the inside direction of a plate thickness of the material B to be cut and where the position is held, the material B to be cut is irradiated from the laser nozzle A with a pulse-like laser beam, the peak output of which is≥50% of the rated output of a laser oscillator 11 and the duty ratio of which is set to≥50%, also the assist gas which is set to lower pressure than the pressure of the assistant gas which is suitable to cut the material B to be cut is jetted and shield gas containing the gaseous oxygen is jetted to the outside of the assist gas. <P>COPYRIGHT: (C)2012,JPO&INPIT</p>
申请公布号 JP5616109(B2) 申请公布日期 2014.10.29
申请号 JP20100095653 申请日期 2010.04.19
申请人 发明人
分类号 B23K26/382;B23K26/00;B23K26/04;B23K26/14 主分类号 B23K26/382
代理机构 代理人
主权项
地址