Method for manufacturing LED

摘要

A method for manufacturing an LED package includes following steps: providing a base with an LED chip mounted on the base; providing a porous carrier with a plurality of holes, and disposing the base on the porous carrier; providing a film with a phosphor layer attached on the film; providing a mold, and putting the porous carrier, the base, the LED chip, and the film into the mold; extracting air from the mold to an external environment through the holes of the porous carrier, and/or, blowing air toward the film to urge the film to move toward the LED chip, resulting in that the film is conformably attached onto the LED chip and the base; and solidifying the phosphor layer on the LED chip by means of heating whereby the phosphor is conformably and securely attached on the LED chip.

主权项

1. A method for manufacturing an LED, comprising following steps:
providing a base and an LED chip, and disposing the LED chip on the base; providing a porous carrier with a plurality of holes and disposing the base on the porous carrier; providing a film with a phosphor layer attached on the film, and placing the film on the LED chip wherein the phosphor layer contacts the LED chip; providing a mold, wherein the porous carrier, the base, the LED chip, and the film are received in an interior of the mold; extracting air from the interior of the mold through the holes of the porous carrier, to attach the film with the phosphor layer conformably onto the base and the LED chip; and solidifying the phosphor layer.