Dynamic Height Adjusting System and Method for Head Assembly of Laser Processing System

摘要

The present invention relates to a dynamic height adjusting system and method that uses capacitance for a head assembly of a laser processing system throughout a process cycle. The proposed system and method involves use of a single frequency in which a change in phase is measured and processed to determine changes in height and distance between a work piece with an increased reliability. The system further enables operative computerized processor control and substantial improvements in process control signal and feedback distribution throughout an integrated system and optional remote interfaces.

主权项

1. A method for adjusting a cutting head height relative to a work piece in a laser processing system, comprising the steps of:
positioning a capacitance sensor in said cutting head relative to said work piece; applying at least a first signal having a first frequency to said sensor; monitoring continuously a phase change of said first signal as a capacitance change in said sensor by evaluating said first signal during a use; and comparing said phase change to a measured height reference range, thereby determining said cutting head height relative to said work piece.