发明名称 EMBEDDED MULTILAYER CAPACITOR AND PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CAPACITOR
摘要 <p>The present invention includes: a dielectric layer; a ceramic body with a thickness no greater than 100μm which has first and second main surfaces (S1, S2) which face with each other, first and second side surfaces (S5, S6) which face each other, and first and second cross sectional surfaces (S3, S4) which face each other; first and second internal electrodes which are alternately formed to expose the first side surface (S5) or the second side surface (S6) of the body while having the dielectric layer therebetween; and first and second external electrodes which are formed in the first and second side surfaces (S5, S6) of the ceramic body. The first external electrode is electrically connected to a first internal electrode, and the second external electrode is electrically connected to a second internal electrode. The first external electrode includes a first electrode layer and a first metal layer which is formed on the first electrode layer. The second external electrode includes a second electrode layer and a second metal layer which is formed on the second electrode layer. The first and second external electrodes are extended toward the first main surface of the ceramic body. Provided is the substrate-embedded type multilayer ceramic electronic part which satisfies 0 <= BWmax - BWmin <= 100μm wherein the maximum width and the minimum width of at least one between the first and second external electrodes is BWmax and BWmin, respectively.</p>
申请公布号 KR101452131(B1) 申请公布日期 2014.10.16
申请号 KR20130103714 申请日期 2013.08.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, JIN WOO;JUNG, JIN MAN
分类号 H01G4/30;H05K3/46 主分类号 H01G4/30
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