发明名称 FIBER OPTIC SUB-ASSEMBLY WITH LOW PROFILE
摘要 A fiber optic sub-assembly includes a printed circuit and a TIR sub-assembly supported by the printed circuit board. The printed circuit board includes opposed first and second surfaces and has a printed circuit board height defined by the distance between the first and second surfaces. The TIR sub-assembly has a nominal height between lowermost and uppermost portions thereof The TIR sub-assembly is at least partially integrated into the printed circuit board so that an overall stack height of the printed circuit board and TIR sub-assembly is less than the sum of the printed circuit board height and nominal height of the TIR sub-assembly.
申请公布号 US2014294352(A1) 申请公布日期 2014.10.02
申请号 US201313906701 申请日期 2013.05.31
申请人 CORNING CABLE SYSTEMS LLC 发明人 Ertel John Phillip
分类号 G02B6/32 主分类号 G02B6/32
代理机构 代理人
主权项 1. A fiber optic sub-assembly, comprising: a printed circuit board having opposed first and second surfaces, wherein one of the first and second surfaces is an upper surface of the printed circuit board and the other of the first and second surfaces is a lower surface of the printed circuit board; and a total internal reflection sub-assembly supported by the printed circuit board and defining an optical path, the total internal reflection sub-assembly comprising: an active device electrically coupled to the printed circuit board, the active device being configured to emit light normal to the first or second surface of the printed circuit board or to collect light directed toward the active device;a lens spaced apart from the active device and positioned in the optical path, the lens being configured to collect the light emitted by or concentrate the light directed to the active device; andan optical turning member configured to change the direction of the optical path; wherein at least a portion of the optical path between the active device and lens is located between the first and second surfaces of the printed circuit board.
地址 Hickory NC US