发明名称 THIN FILM SOLDER BOND
摘要 A device, system, and method for solar cell construction and bonding/layer transfer are disclosed herein. An exemplary structure of solar cell construction involves providing a monocrystalline donor layer. A solder bonding layer bonds the donor layer to a carrier substrate. A porous layer may be used to separate the donor layer.
申请公布号 EP2702616(A4) 申请公布日期 2014.10.01
申请号 EP20120777290 申请日期 2012.04.29
申请人 AMBERWAVE, INC. 发明人 LOCHTEFELD, ANTHONY;LEITZ, CHRIS;CARROLL, MARK
分类号 H01L31/18;H01L31/0687 主分类号 H01L31/18
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