MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH PROTECTIVE MEMBER, MULTIPLE MOUNTED COMPONENT OF LEAD FRAME WITH PROTECTIVE MEMBER AND RESIN, AND MULTIPLE MOUNTED COMPONENT OF SEMICONDUCTOR DEVICE WITH PROTECTIVE MEMBER

摘要

PROBLEM TO BE SOLVED: To provide: a multiple mounted component of a lead frame with a protective member, capable of preventing generation of metal powder from the rear surface or the outer peripheral side surface of a frame body; a multiple mounted component of a lead frame with a protective member and a resin; and a multiple mounted component of a semiconductor device with a protective member.SOLUTION: A multiple mounted component of a lead frame with a protective member includes: a multiple mounted component MS of a lead frame, including a lead frame 10 to which an LED element 2 is connected and which is multiple mounted to a frame body F; and a tape T bonded on at least a part of a surface of the frame body F, the surface being on the opposite side to a side to which the LED element 2 is connected.