| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that has a small mounting volume and that is suitable for high integration.SOLUTION: A semiconductor device according to one embodiment comprises a substrate, a first semiconductor chip, a second semiconductor chip, and a discrete component. The first semiconductor chip is arranged on the substrate, and has a first electrode group. The second semiconductor chip is arranged on the substrate, and has a second electrode group. At least one electrode included in the second electrode group is connected to at least one electrode included in the first electrode group via at least one bonding wire. The discrete component is arranged below the bonding wire, on the substrate. |
