| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film which is small in hygroscopic expansion and excellent in dimensional stability, has high heat resistance and sufficient film strength, and is excellent in handleability at the time of processing or mounting, while taking advantage of excellent characteristics of a polyimide resin.SOLUTION: A polyimide film has a polyimide resin layer (A), as a main layer, which has a hygroscopic expansion coefficient of 9 ppm/%RH or less and contains 50-95 mol% of a structural unit produced from pyromellitic dianhydride and 2,2'-ditrifluoromethylbenzidine, and 5-50 mol% of a structural unit produced from an acid dianhydride and diamines including 2,2'-dimethylbenzidine and 2,2'-bis(aminophenoxyphenyl)propane. |
