发明名称 |
Methods for Bonding Substrates Using Liquid Adhesive |
摘要 |
Structures in an electronic device such as substrates associated with a display may be bonded together using liquid adhesive. Fiber-based equipment may be used to apply ultraviolet light to peripheral edges of an adhesive layer during bonding. There-dimensional adhesive shapes may be produced using nozzles with adjustable openings, computer-controlled positioners, and other adhesive dispensing equipment. Ultraviolet light may be applied to liquid adhesive through a mask with an opacity gradient. Adjustable shutter structures may control adhesive exposure to ultraviolet light. Ultraviolet light exposure may be used to create an adhesive dam that helps create a well defined adhesive border. Multiple layers of adhesive may be applied between a pair of substrates. |
申请公布号 |
US2014246148(A1) |
申请公布日期 |
2014.09.04 |
申请号 |
US201414183224 |
申请日期 |
2014.02.18 |
申请人 |
Apple Inc. |
发明人 |
Liu Cyrus Y.;Sung Kuo-Hua;Chen Po-Jui;Grespan Silvio |
分类号 |
H05K5/06;H05K13/00 |
主分类号 |
H05K5/06 |
代理机构 |
|
代理人 |
|
主权项 |
1. A method for bonding substrates, comprising:
applying liquid adhesive to at least one of the substrates; and applying ultraviolet light to an edge of the liquid adhesive using fiber-based equipment. |
地址 |
Cupertino CA US |