3-dimensional integrated circuit testing using MEMS switches with tungsten cone contacts

摘要

A test system for testing a multilayer 3-dimensional integrated circuit (IC), where two separate layers of IC circuits are temporarily connected in order to achieve functionality, includes a chip under test with a first portion of the 3-dimensional IC, and a test probe chip with a second portion of the 3-dimensional IC and micro-electrical-mechanical system (MEMS) switches that selectively complete functional circuits between the first portion of the 3-dimensional IC in a first IC layer to circuits within the second portion of the 3-dimensional IC in a second IC layer. The MEMS switches include tungsten (W) cone contacts, which make the selective electrical contacts between circuits of the chip under test and the test probe chip and which are formed using a template of graded borophosphosilicate glass (BPSG).

主权项

1. A test probe chip, comprising:
an integrated circuit (IC) layer that forms a portion of a 3-dimensional IC, said IC layer being formed above a base layer; a first through silicon via (TSV), said first TSV contacting said IC layer and extending through said base layer to contact a micro-electrical-mechanical systems (MEMS) switch, said MEMS switch comprising:
a beam having an upper surface of a first end that contacts an extension of said first TSV beneath a lower surface of said base layer,a tungsten (W) cone contact disposed on a lower surface at a second end of said beam, andan actuator disposed on said lower surface of said base layer and separated from said upper surface of said second end of said beam by an air gap, when not actuated.