SEMICONDUCTOR PACKAGE

摘要

The present invention relates to a semiconductor package. More specifically, the present invention relates to a new semiconductor package with an improved structure which maximizes the thermal radiation performance of a flip chip ball grid array type package. To achieve this, the present invention in a semiconductor package which includes a semiconductor chip where a conductive bump is formed in a bonding pad, a substrate bonded to the conductive bump, an underfill material which protects the conductive bump between the substrate and the semiconductor chip, and a lead attached to the upper surface of the substrate and the upper surface of the semiconductor chip, has a thermal radiation unit which includes a heat transfer material between the semiconductor chip and the lead or between the substrate and the lead.