LOW POWER, HIGH SPEED MULTI-CHANNEL CHIP-TO-CHIP INTERFACE USING DIELECTRIC WAVEGUIDE

摘要

Provided is a multi-channel chip-to-chip communication interface apparatus. According to an embodiment of the present invention, the multi-channel chip-to-chip communication interface apparatus a metal wire disposed on a printed circuit board (PCB) with an antenna pattern on which a via is opened in the form of a constant shape; and a waveguide composed of a dielectric body which is a section of the form fitting to the via to be connected to the via.