| 摘要 |
<p>A method of forming a hybridized device comprising forming a first microelectronic component provided, on a surface, with metal balls, and a second microelectronic component provided, on a surface, with connection elements corresponding to said metal balls, and hybridizing the first and second components to attach the metal balls of the first component to the connection elements of the second component. The manufacturing of the second microelectronic component comprises forming a substrate provided with cavities at the locations provided for the connection elements, and forming resistive elements made of fusible metal respectively suspended above the cavities. The hybridizing of the first and second components comprises transferring the first component onto the second component to have the metal balls rest on the suspended resistive elements, and circulating an electric current through the resistive elements to melt said elements.</p> |
