发明名称 CAMERA MODULE AND ASSEMBLING METHOD THEREOF
摘要 A camera module, according to an embodiment of the present invention, comprises: a printed circuit board in which an image sensor is mounted; a base which is installed on the upper side of the printed circuit board, and includes a terminal unit connected to be able to apply an electric current between the printed circuit board and a window at a position corresponding to the image sensor; an infrared ray blocking filter installed on the upper side of the base; a dust trap resin applied to the upper surface of the base; and an air shooting hole formed through a part in the vicinity of the terminal unit of the base.
申请公布号 KR20140076822(A) 申请公布日期 2014.06.23
申请号 KR20120145297 申请日期 2012.12.13
申请人 LG INNOTEK CO., LTD. 发明人 PARK, WOO JIN
分类号 H04N5/225;H01L27/146 主分类号 H04N5/225
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