| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor wafer capable of avoiding mixing of air bubbles between an adhesive sheet and a wafer when the adhesive sheet for protection is stuck to the wafer, and to provide a manufacturing method of the semiconductor wafer.SOLUTION: A plurality of circuit patterns 10 are formed on a surface of a semiconductor wafer W. Streets 11 are formed between the circuit patterns 10 in vertical and lateral directions so that they show a latticed pattern. Through holes 12 penetrating the wafer W are formed in the respective streets 11 so that they are dispersed along the streets 11 with a prescribed interval therebetween. After an adhesive sheet S for protection is stuck to a side of the circuit pattern 10, processing such as backside grinding and dicing is applied to the wafer W.</p> |
