| 摘要 |
The present invention includes a temporary hardening unit which temporarily hardens the alignment film by heating the alignment film using plasma to uniformly harden the alignment film which is formed on a substrate which is transferred, a hardening unit which hardens the alignment film by reheating the alignment film using the plasma, a rubbing unit which rubs the alignment film by etching the alignment film using the plasma, and a transferring unit which transfers the substrate to continuously pass through the temporary hardening unit, the hardening unit, and the rubbing unit. Thereby, defects due to a temperature difference in a transfer process are minimized by reducing the transfer time of the substrate on which the alignment film is formed. |
