| 摘要 |
PROBLEM TO BE SOLVED: To reduce deformation caused by heat generated during the operation.SOLUTION: A package 1 for storing an electronic element includes: a base substance 11 including a cavity part 11e in which an electronic element 2 is stored; an electrode 14 disposed at a center region on a lower surface of the base substance 11; a lid 12 which is joined to an upper surface of the base substance 11 so as to cover the cavity part 11e; and a frame like member 13 which is joined to a peripheral region of the lower surface of the base substance 11. The base substance 11 has a first heat expansion coefficient. The lid 12 has a second heat expansion coefficient larger than the first heat expansion coefficient. The frame like member 13 has a third heat expansion coefficient larger than the first heat expansion coefficient. |
