倒装晶片互连结构,申请号TW097141705-传众专利搜索

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发明名称	倒装晶片互连结构
摘要
申请公布号	TWI440106	申请公布日期	2014.06.01
申请号	TW097141705	申请日期	2008.10.29
申请人	茂力科技股份有限公司美国	发明人	蒋航
分类号	H01L21/60;H01L23/48	主分类号	H01L21/60
代理机构		代理人	蔡清福台北市中山区中山北路3段27号13楼
主权项
地址	美国

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