| 摘要 |
PROBLEM TO BE SOLVED: To appropriately perform processing such as scribing, cutting and the like even on a thin workpiece while suppressing cost increase.SOLUTION: The laser processing device includes: a workpiece support part for supporting a workpiece W; a laser irradiation part for irradiating a front surface of the workpiece supported by the workpiece support part, with laser light; a conveyance part for relatively moving the laser irradiation part and the workpiece; a jet part provided on a front side in a movement direction of the workpiece, with respect to the laser irradiation part, for jetting a cooling medium onto the front surface of the workpiece irradiated with the laser light; a first roller 6 for rotating and coming into contact with a back surface Sb of the workpiece, located on a side opposite to the front surface of the workpiece, being a cooling area B of the workpiece, cooled by the cooling medium jetted from the jet part; and second rollers 7 at least a pair of which are provided across the cooling area of the workpiece, which rotate and come in contact with the front surface of the workpiece, and sandwich the workpiece between the first roller and the second rollers. |
