发明名称 |
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF |
摘要 |
A fabrication method of a package structure is provided, which includes the steps of: providing an interposer having a plurality of recess holes; forming a conductive bump in a lower portion of each of the recess holes; forming a conductive through hole on the conductive bump in each of the recess holes; removing a portion of the interposer so as for the conductive bumps to protrude from the interposer; and mounting at least a first external element on the conductive bumps, thereby simplifying the fabrication process, shortening the process time and reducing the material cost. |
申请公布号 |
US2014117538(A1) |
申请公布日期 |
2014.05.01 |
申请号 |
US201313949557 |
申请日期 |
2013.07.24 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
CHEN KUANG-HSIN;LU CHUN-HUNG |
分类号 |
H01L23/498;H01L21/50 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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