| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for improving the reliability of mounting joint between a package for an electronic component and a circuit board.SOLUTION: A shortest gap dimension from a plan view electrodeless region side edge of a first terminal electrode 12 in a short side direction of a bottom surface of a base 1 to plan view edges of wiring pads 41, 24, and a shortest gap dimension from a plan view electrodeless region side edge of a second terminal electrode 13 in a short side direction of the bottom surface of the base 1 to plan view edges of wiring pads 41, 24, are same size and are represented by the shortest gap dimension G1. A shortest gap dimension from a plan view electrodeless region side edge of the first terminal electrode 12 in a long side direction of the bottom surface of the base 1 to plan view edges of wiring pads 41, 24, and a shortest gap dimension from a plan view electrodeless region side edge of the second terminal electrode 13 in a long side direction of the bottom surface of the base 1 to plan view edges of wiring pads 41, 24, are same size and are represented by the shortest gap dimension G3. The shortest gap dimension G1 and the shortest gap dimension G3 are same size.</p> |
