| 摘要 |
Methods of implanting dopant ions in a substrate include depositing a sacrificial material on a substrate. Dopant ions are implanted into the substrate while sputtering the sacrificial material, without substantially sputtering the substrate. Substantially no sacrificial material remains on the substrate after the implanting of the dopant ions. Some methods include forming a sacrificial material over a substrate and implanting dopant ions into the substrate while removing substantially all the sacrificial material from the substrate. Substantially no sputtering of the substrate occurs during the implanting of the dopant ions. Methods of doping a substrate include implanting dopant ions into a substrate having a sacrificial material thereon and sputtering the sacrificial material while implanting the dopant ions without substantially sputtering the substrate. Substantially no sacrificial material remains on the substrate after implanting the dopant ions. |
