发明名称 METAL BASE CIRCUIT BOARD AND MOUNTING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a metal base circuit board which is surface-mounted on a wiring board while keeping an advantage that is excellent heat radiation performance.SOLUTION: A metal base circuit board 1 has a structure where a circuit layer 4 is laminated on a base metal 2 through an insulation layer 3. Both end parts 11, 12 are folded so that the base metal 2 is located at the inner side. In both end parts 11, 12, a pair of electrodes 6, 7 is exposed so that the circuit layer 4 is electrically connected with a wiring board 5 when the metal base circuit board 1 is mounted on the wiring board 5. The structure enables the electrodes 6, 7 to contact with circuit wiring 5a, 5b of the wiring board 5 and establish electrical continuity therebetween when the metal base circuit board 1 is mounted on the wiring board 5.
申请公布号 JP2014072331(A) 申请公布日期 2014.04.21
申请号 JP20120216600 申请日期 2012.09.28
申请人 SUMITOMO CHEMICAL CO LTD 发明人 NEZU HIDEAKI
分类号 H05K1/05 主分类号 H05K1/05
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