发明名称 |
Method for removing micro-debris and device of the same |
摘要 |
The present invention provides a method for removing micro-debris generated in a laser machining process operated on machined object and device of the same. The machined object is placed on a movable machining platform within a machining range and machined at a particular machining location. By disposing an acoustic wave generator and a reflector part, or by disposing a plurality of acoustic wave generators, at least two standing waves extending across the machining range and two standing wave nodes are generated. The micro-debris generated from the laser machining process is moved away by the standing waves to concentrate at the standing wave nodes, and subsequently removed from the standing wave nodes. |
申请公布号 |
US8685168(B2) |
申请公布日期 |
2014.04.01 |
申请号 |
US201213421619 |
申请日期 |
2012.03.15 |
申请人 |
TSAI WU-JUNG;CHENG CHUNG-WEI;TSAI MI-CHING;YAO WU-SUNG;WANG SHENG-HE;INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
TSAI WU-JUNG;CHENG CHUNG-WEI;TSAI MI-CHING;YAO WU-SUNG;WANG SHENG-HE |
分类号 |
B01D49/00 |
主分类号 |
B01D49/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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