发明名称 |
ELECTRONIC ASSEMBLY WITH DETACHABLE COOLANT MANIFOLD AND COOLANT-COOLED ELECTRONIC MODULE |
摘要 |
Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module. |
申请公布号 |
US2014078672(A1) |
申请公布日期 |
2014.03.20 |
申请号 |
US201213616337 |
申请日期 |
2012.09.14 |
申请人 |
BRUNSCHWILER THOMAS J.;COLGAN EVAN G.;ELLSWORTH, JR. MICHAEL J.;ESCHER WERNER;MEIJER INGMAR G.;PAREDES STEPHAN;SCHLOTTIG GERD;WITZIG MARTIN;ZITZ JEFFREY A.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BRUNSCHWILER THOMAS J.;COLGAN EVAN G.;ELLSWORTH, JR. MICHAEL J.;ESCHER WERNER;MEIJER INGMAR G.;PAREDES STEPHAN;SCHLOTTIG GERD;WITZIG MARTIN;ZITZ JEFFREY A. |
分类号 |
H05K7/20;H05K13/00 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|