| 摘要 |
PROBLEM TO BE SOLVED: To provide an imprint method with which an unevenness defect in a transferred material uneven structure to be transferred can be reduced, and an imprint device for implementing the same.SOLUTION: An imprint method of the present invention includes: a supply step of supplying a transferred material to at least one of a surface of a mold including an uneven structure region and a substrate; and a filling step of filling, with the transferred material, a gap between the surface of the mold including the uneven structure region and the substrate. The filling step includes: a proximity operation for making proximate the surface of the mold including the uneven structure region and the substrate; and an enhancement gas inflow operation for performing inflow of enhancement gas that performs a defect reduction action between the surface of the mold including the uneven structure region and the substrate. The proximity operation is performed to propagate contact between the mold and the transferred material while expanding a contact area between the mold and the transferred material from a first point to start the contact to a second point to complete the contact. The enhancement gas inflow operation is configured in such a manner that an inflow direction of the enhancement gas becomes the same direction as or an acute-angle direction including a right angle with respect to a propagation direction connecting the first point and the second point. |
