发明名称 Semiconductor device
摘要 Electrode pads respectively have a probe region permitting probe contact and a non-probe region. In each of the electrode pads arranged zigzag in two or more rows, a lead interconnect for connecting another electrode pad with an internal circuit is not placed directly under the probe region but placed directly under the non-probe region.
申请公布号 US8669555(B2) 申请公布日期 2014.03.11
申请号 US201213684369 申请日期 2012.11.23
申请人 PANASONIC CORPORATION 发明人 TAKAHASHI MASAO;TAKEMURA KOJI;SAKASHITA TOSHIHIKO;MIMURA TADAAKI
分类号 H01L23/485;H01L21/66;H01L23/528 主分类号 H01L23/485
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