| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition from which a cured product having excellent heat resistance and a low thermal expansion coefficient and exhibiting little change in heat resistance after a thermal history is obtained, and to provide a cured product obtained by curing the same and a printed wiring board.SOLUTION: The curable resin composition contains an epoxy resin (A) and a phenol resin (B). The epoxy resin (A) essentially contains a trimer (a1) represented by structural formula (1) (In the formula, Rand Reach independently represent a hydrogen atom, a C1-C4 alkyl group, or a C1-C4 alkoxy group, and G represents a glycidyl group.) and a dimer (a2) in which naphthol compounds substituted with a glycidyl group are bonded via a methylene bond. The phenol resin (B) has a resin structure in which a naphthol skeleton (n) and a naphthoquinone skeleton (q) are bonded via a methylene bond. |
