PACKAGING WITH INTERPOSER FRAME

摘要

A mechanism using an interposer frame for packing a semiconductor die realizes a fanout structure and reduces a form factor for a packed semiconductor die. The mechanism includes a step of using a molding compound to bonding the semiconductor die to an interposer frame and a step of forming a redistribution layer one side or both sides of the semiconductor die. The redistribution layer(s) in a package realizes the formation and connection of the fanout connection of an external connection structure.