| 摘要 |
18A surface mount packaging structure that yields improved thermo-mechanical reliability andmore robust second-level package interconnections is disclosed. The surface mountpackaging structure includes a sub-module having a dielectric layer, semiconductor devicesattached to the dielectric layer, a first level metal interconnect structure electrically coupled tothe semiconductor devices, and a second level I/O connection electrically coupled to the firstlevel interconnect and formed on the dielectric layer on a side opposite the semiconductordevices, with the second level I/O connection configured to connect the sub-module to anexternal circuit. The semiconductor devices of the sub-module are attached to the first surfaceof a multi-layer substrate structure, with a dielectric material positioned between the dielectriclayer and the multi-layer substrate structure to fill in gaps in the surface-mount structure andprovide additional structural integrity thereto.Figure 1 A surface mountpackaging structure that yields improved thermo-mechanical reliability andmore robust second-level package interconnections is disclosed. The surfacemount packaging structure includes a sub-module having a dielectric layer,semiconductor devices attached to the dielectric layer, a first level metalinterconnect structure electrically coupled to the semiconductor devices, anda second level I/O connection electrically coupled to the first levelinterconnect and formed on the dielectric layer on a side opposite thesemiconductor devices, with the second level I/O connection configured toconnect the sub-module to an external circuit. The semiconductor devices ofthe sub-module are attached to the first surface of a multi-layer substratestructure, with a dielectric material positioned between the dielectric layerand the multi-layer substrate structure to fill in gaps in the surface-mountstructure and provide additional structural integrity thereto. Figure 1 |
