SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a semiconductor package having an antenna which is integrally formed and manufacturing method thereof. The semiconductor package according to the present invention comprises: a semiconductor chip; an encapsulation unit for encapsulating the semiconductor chip; a substrate unit including an upper substrate formed on the top of the encapsulating unit and a lower substrate formed on the bottom of the encapsulation unit; an antenna unit which is formed in the encapsulation unit or substrate unit and electrically connected to the semiconductor chip; and a via connection unit which penetrates through the encapsulation unit, wherein the semiconductor unit transmits and receives high frequency waves on a millimeter wave band through the antenna unit, the antenna unit is electrically connected to the semiconductor unit through the via connection unit, the antenna unit is formed on the outer surface of the upper substrate, the upper substrate is a stacked substrate, and the antenna unit may have a plurality of emitters formed on multiple layers of the upper substrate.