| 摘要 |
PROBLEM TO BE SOLVED: To provide a power module device capable of preventing high temperature from adversely affecting a semiconductor and absorbing heat stress differences at low costs.SOLUTION: A power module device includes: a substrate 1; a power semiconductor 3 soldered to a metal layer 2 provided on one surface of the substrate 1; and a cooler 7 including multiple cooling passages 7b, 7c and soldered to a metal layer 5 provided on the other surface of the substrate 1. At least one recess 7a is formed along the cooling passages 7b, 7c in the cooler 7, and the cooling passages 7b, 7c are divided into multiple regions by the recess 7a. |
