METHOD FOR PRODUCING MORE PARTICULARLY PROCESSING OR POPULATING, A CIRCUIT BOARD ELEMENT AND CARRIER FOR USE IN SUCH A METHOD

摘要

In a method for producing a circuit board element, the following steps are provided: providing a substantially whole-area carrier having an adhesive surface; arranging and fixing a starting material of the circuit board element to be produced on the adhesive surface of the carrier; producing the circuit board element fixed on the carrier in a position fixed on the carrier; and removing the produced circuit board element from the carrier. Furthermore, a carrier for use in such a method is provided, wherein it is possible, in particular, to dispense with complex steps for separating or singulating circuit board elements and, with conservation of resources as a result of reusability of a carrier, it is possible to obtain cost savings in the production of circuit board elements.