发明名称 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD
摘要 A positive photosensitive composition comprises: (A) a resin that has an acid decomposable repeating unit represented by formula (I) and increases its solubility in an alkali developer by action of an acid; (B) a compound that generates an acid in irradiation with actinic light or radiation; (C) a resin that has: at least one of a fluorine atom and a silicon atom; and a group selected from the group consisting of groups (x) to (z); and (D) a solvent: (x) an alkali soluble group, (y) a group which decomposes by action of an alkali developer and increases a solubility of the resin (C) in an alkali developer, and (z) a group which decomposes by action of an acid, wherein, Xa1 represents a hydrogen atom, an alkyl group, a cyano group or a halogen atom, Ry1 to Ry3 each independently represents an alkyl group or a cycloalkyl group, and at least two of Ry1 to Ry3 may be coupled to form a ring structure, and Z represents a divalent linking group.
申请公布号 KR101359655(B1) 申请公布日期 2014.02.05
申请号 KR20097019594 申请日期 2008.03.27
申请人 发明人
分类号 G03F7/004;G03F7/039 主分类号 G03F7/004
代理机构 代理人
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