| 摘要 |
<p>[Problem] To provide a method of inspection, with high speed and high accuracy, of the electrical characteristics of a large quantity of chip electronic components, using two or more inspection elements. [Solution] A method of inspection of chip electronic components in which inspection of the electrical characteristics of the chip electronic components that are the subject of inspection is performed, including: a step of electrically connecting mutually independent inspection elements to these respective chip electronic components, in a condition in which two or more chip electronic components to be inspected, that are manufactured so as to show prescribed identical electrical characteristics in accordance with respective identical standards are arranged in mutually adjacent fashion; and a step of applying inspection voltages mutually having the same or substantially the same frequency to respective chip electronic components from the inspection elements and detecting by the inspection elements the current values generated by the chip electronic components by application of this inspection voltage, characterised in that application of the inspection voltage from the inspection elements to the chip electronic components is performed in mutually non-overlapping periods.</p> |
