发明名称 |
Cooling System for Electronics |
摘要 |
An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus. |
申请公布号 |
US2014009882(A1) |
申请公布日期 |
2014.01.09 |
申请号 |
US201213543089 |
申请日期 |
2012.07.06 |
申请人 |
COX AARON R.;GRADY, IV WILLIAM J.;KAMATH VINOD;MATTESON JASON A.;MINYARD JASON E.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
COX AARON R.;GRADY, IV WILLIAM J.;KAMATH VINOD;MATTESON JASON A.;MINYARD JASON E. |
分类号 |
H05K7/20;B23P19/04;F28D15/00;F28D15/02;F28F7/00;G06F1/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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