METHOD OF COATING BY PULSED BIPOLAR SPUTTERING

摘要

The present invention concerns a method of pulsed bipolar sputtering, the method comprising the steps of: - applying a sputtering pulse (-) during a first period of time (T-) / and - applying a revers voltage pulse during a subsequent second period of time (T+). The step of applying the revers voltage pulse comprises controlling, in particular adjusting, the timing of the revers voltage pulse (T+). This way high quality sputtering is achieved, in particular for sputtering temperature sensitive materials.