发明名称 WAFER WITH RECESSED PLUG
摘要 <p>In one embodiment, a method of forming a plug includes providing a base layer, providing an intermediate oxide layer above an upper surface of the base layer, providing an upper layer above an upper surface of the intermediate oxide layer, etching a trench including a first trench portion extending through the upper layer, a second trench portion extending through the oxide layer, and a third trench portion extending into the base layer, depositing a first material portion within the third trench portion, depositing a second material portion within the second trench portion, and depositing a third material portion within the first trench portion.</p>
申请公布号 SG194477(A1) 申请公布日期 2013.12.30
申请号 SG20130076344 申请日期 2012.04.13
申请人 ROBERT BOSCH GMBH 发明人 GRAHAM, ANDREW, B.;YAMA, GARY;O'BRIEN, GARY
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