发明名称 METHOD FOR PROCESSING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SUBSTRATE PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for processing a substrate capable of forming a source/drain region having desired dopant concentration while securing a deposition speed, a method for manufacturing a semiconductor device, and a substrate processing device.SOLUTION: A method for processing a substrate including an insulating film in at least a part of a surface, a source part, a drain part, a gate part, and a structure which uses monocrystal silicon in a gate channel disposed below the gate part comprises the steps of: growing amorphous doped silicon and monocrystal silicon by supplying at least a silicon-containing gas and a doping gas; and single-crystallizing the amorphous doped silicon using the monocrystal silicon as a seed by heating the amorphous doped silicon and the monocrystal silicon.
申请公布号 JP2013258188(A) 申请公布日期 2013.12.26
申请号 JP20120131857 申请日期 2012.06.11
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 MORIYA ATSUSHI;ISHIBASHI KIYOHISA;TOMINARI TATSUYA
分类号 H01L21/205;C23C16/24;C23C16/56;H01L21/20;H01L21/336;H01L29/78;H01L29/786 主分类号 H01L21/205
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