发明名称 |
METHOD FOR PROCESSING SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SUBSTRATE PROCESSING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a substrate capable of forming a source/drain region having desired dopant concentration while securing a deposition speed, a method for manufacturing a semiconductor device, and a substrate processing device.SOLUTION: A method for processing a substrate including an insulating film in at least a part of a surface, a source part, a drain part, a gate part, and a structure which uses monocrystal silicon in a gate channel disposed below the gate part comprises the steps of: growing amorphous doped silicon and monocrystal silicon by supplying at least a silicon-containing gas and a doping gas; and single-crystallizing the amorphous doped silicon using the monocrystal silicon as a seed by heating the amorphous doped silicon and the monocrystal silicon. |
申请公布号 |
JP2013258188(A) |
申请公布日期 |
2013.12.26 |
申请号 |
JP20120131857 |
申请日期 |
2012.06.11 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
MORIYA ATSUSHI;ISHIBASHI KIYOHISA;TOMINARI TATSUYA |
分类号 |
H01L21/205;C23C16/24;C23C16/56;H01L21/20;H01L21/336;H01L29/78;H01L29/786 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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