发明名称 POWER MODULE
摘要 PROBLEM TO BE SOLVED: To provide a power module which can minimize a plane area even when a plurality of electronic components and a plurality of output terminals are provided.SOLUTION: A power module comprises: a plurality of power semiconductor substrates 1 each including power semiconductors 5; a control circuit board 2 including electronic components 6 that compose a control circuit for the power semiconductor substrate 1; and a bus bar structure 3 including conductive bus bars 4. The bus bar structure 3 holds each power semiconductor substrate 1 and the control circuit board 2 so as be overlapped with each other in planar view. The bus bars electrically connect each power semiconductor substrate 1 with the control circuit board 2.
申请公布号 JP2013247192(A) 申请公布日期 2013.12.09
申请号 JP20120118724 申请日期 2012.05.24
申请人 NEC ACCESS TECHNICA LTD 发明人 AKAHORI HIDEKI
分类号 H01L25/10;H01L23/34;H01L23/48;H01L25/18 主分类号 H01L25/10
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