The present invention relates to compositions comprising a thermally conductive porous media, optionally linked to a heat spreading interfacial material. These compositions provide heat dissipation from a heat source. These compositions can be used in a variety of applications including effective removal of heat from electronic and other enclosed devices.
申请公布号
WO2013040289(A3)
申请公布日期
2013.11.14
申请号
WO2012US55286
申请日期
2012.09.14
申请人
POREX CORPORATION;DIBATTISTA, GERALD A.;MACE, TAMARA LEE;WINGO, JAMES P.;MAO, GUOQIANG
发明人
DIBATTISTA, GERALD A.;MACE, TAMARA LEE;WINGO, JAMES P.;MAO, GUOQIANG
