发明名称 Semiconductor device of which breakdown voltage is improved
摘要 A semiconductor device includes: a semiconductor substrate; a gate electrode formed on the semiconductor substrate through a gate insulating film; a source diffusion layer and a drain diffusion layer formed on both sides of the gate electrode, respectively, in the semiconductor substrate; and a field drain section formed below the gate electrode in the semiconductor substrate so as to be positioned between the gate electrode and the drain diffusion region and include an insulator. The field drain section includes: a first insulating film configured to be contact with the semiconductor substrate, and a second insulating film configured to be formed on the first insulating film and has a dielectric constant higher than a dielectric constant of the first insulating film.
申请公布号 US8581340(B2) 申请公布日期 2013.11.12
申请号 US201113189860 申请日期 2011.07.25
申请人 SASAKI KENJI;RENESAS ELECTRONICS CORPORATION 发明人 SASAKI KENJI
分类号 H01L29/66 主分类号 H01L29/66
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