发明名称 |
PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND METHODS OF FABRICATING THE SEMICONDUCTOR PACKAGES |
摘要 |
A package substrate, a semiconductor package having the same, and a method for fabricating the semiconductor package. The semiconductor package includes a semiconductor chip, a package substrate, and a molding layer. The package substrate provides a region mounted with the semiconductor chip. The molding layer is configured to mold the semiconductor chip. The package substrate includes a first opening portion that provides an open region connected electrically to the semiconductor chip and extends beyond sides of the semiconductor chip to be electrically connected to the semiconductor chip.
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申请公布号 |
US2013288431(A1) |
申请公布日期 |
2013.10.31 |
申请号 |
US201313924817 |
申请日期 |
2013.06.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK JIN-WOO;LIM HWAN-SIK;AHN EUNCHUL |
分类号 |
H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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